DING Dazhi, FAN Wen, CHEN Xinping, LI Chunyu, ZHANG Tiancheng, BAO Huaguang
With the rapid evolution of the electronic systems toward higher operating frequencies, higher power densities, and higher levels of integration, their working environments have become increasingly complex, characterized by the coexistence of strong electromagnetic excitation, extreme temperatures, low-pressure conditions, and radiation effects. Electromagnetically-centered strongly coupled multi-physics effects significantly impact the performance evolution and reliability of devices and systems, rendering traditional single-physics or weakly coupled analysis methods inadequate for engineering applications. Focusing on the multi-physics synergy of electronic systems within complex environments, this paper systematically reviews typical coupling mechanisms, including electromagnetic-thermal, electromagnetic-plasma, electromagnetic-thermal-mechanical, and radiation-particle interactions. Emphasis is placed on recent advances in multi-physics modeling approaches, numerical computation techniques, and their applications across device, packaging, and system levels. Through a comparative analysis of the representative studies in strong electromagnetic environments, satellite discharge environments, and irradiation environments, the major challenges currently faced by the multi-physics collaborative simulation in areas such as cross-scale modeling, nonlinear solving, computational efficiency, and uncertainty quantification are summarized. Finally, the future research directions of engineering-oriented multi-scale collaborative simulation, the fusion of physical models and data-driven approaches, and system-level reliability assessment are outlined, providing guidance for the design and protection of highly reliable electronic systems operating in complex environments.
